#Tessera technologies stock license

These forward-looking statements are based on SMIC's current assumptions, expectations and projections about future events. Private Securities Litigation Reform Act of 1995. This document contains, in addition to historical information, 'forward-looking statements' within the meaning of the 'safe harbor' provisions of the U.S. (Under the Private Securities Litigation Reform Act of 1995) For more information, please visit Safe Harbor Statements SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm fab in Shanghai a 300mm fab and a majority-owned 300mm fab for advanced nodes in Beijing 200mm fabs in Tianjin and Shenzhen and a majority-owned joint-venture 300mm bumping facility in Jiangyin additionally, in Italy SMIC has a majority-owned 200mm fab. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer.

Semiconductor Manufacturing International Corporation ('SMIC' NYSE: SMI SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. We look forward to working closely with SMIC to integrate this enabling platform into their world-class design and manufacturing environment.'

'SMIC recognizes the significant benefits of DBI technology for customers worldwide. 'We are thrilled to enter into this licensing agreement with SMIC, one of the largest and most respected semiconductor foundries in the world,' said Craig Mitchell, president of Invensas. DBI 3D interconnect can eliminate the need for thru silicon vias (TSVs) reducing die size and cost while providing a roadmap to pixel level interconnect for future generations of image sensors. 'This technology is a key enabler for the fabrication of 3D stacked image sensors, and by working closely with Invensas, we will accelerate the development and commercialization of a new generation of imaging products for our customers.'ĭBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect without requiring bond pressure. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. 'As one of the leading foundries, SMIC delivers advanced semiconductor manufacturing processes to device makers around the world, and we are pleased to integrate DBI technology into our capabilities,' said Dr. This Smart News Release features multimedia. Invensas is a wholly owned subsidiary of Xperi Corporation (Nasdaq:XPER) ('Xperi'). Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers.

#Tessera technologies stock license

SHANGHAI & SAN JOSE, Calif.-(BUSINESS WIRE)- Semiconductor Manufacturing International Corporation (NYSE:SMI SEHK: 981) ('SMIC'), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas' Direct Bond Interconnect (DBI) technology. Leading Semiconductor Foundry to Leverage Revolutionary Wafer Bonding And 3D Interconnect Technology for Advanced Image Sensor Solutions